DVS-EM100/120/130 High-Volume Micro-Silicon OEM Die
An uncompensated, piezoresistive silicon pressure sensing element designed for high-volume OEM applications. These dies offer exceptional linearity and stability for engineers building custom transmitters or medical devices.
As a core sensing element, DAVISOL offers these dies with customized dimensions, specific pressure ranges, and tailored bonding pad layouts to fit your specific PCB or housing requirements.
Integration Capabilities
- Custom pressure transmitters (industrial & automotive)
- Medical instrumentation (blood pressure, respiratory)
- Handheld manometers & diving computers
- HVAC & pneumatic control modules
Integration & Design-In
The EM100 series is designed for seamless integration into high-density electronic environments where precision and miniaturization are paramount.
Technical Suitability
- Suitable for non-corrosive, non-conductive gas or liquid media
- Designed for gold wire bonding or automated flip-chip assembly
Technical Specifications
Key performance parameters: DVS-EM100/120/130 High-Volume Micro-Silicon OEM Die
Performance Characteristics
Electrical Characteristics
Bridge resistance
3.6kΩ - 5.2kΩ
Power supply
Constant current/ voltage
Operating Voltage
5-10 V
Operating Current
Max 2 mA (1 mA typ)
Connection Type
Gold Wire Bonding Pads
Zero Offset
Temperature Coefficient of Resistance
±20 mV
1000 to 2000 ppm/°C (typ 1500)
Temperature Coefficient of Sensitivity
-1000 to 1000 ppm/°C
Pressure Range
2-10000 PSI
Overload Pressure
300 %FS
Burst Pressure
400 %FS
Operating temperature
-40 to 125 °C
Ambient temperature
-55 to 150 °C
Pressure Hysteresis
max 0.1%FS
Non-Linearity
±0.2%FS
Pressure Repeatability
0.1%FS
±0.1%FS/ year
Long-Term Stability
Ordering Information
Because the EM100s series consists of raw sensing dies, ordering is handled through a consultative engineering process rather than a fixed code. To ensure the die meets your wire-bonding and packaging requirements, please provide the following in your quote request:
- Target pressure range (e.g., 0~700 kPa)
- Pressure type (gauge, absolute, or differential)
- Die dimensions required (e.g., 1.5mm x 1.5mm or 2.0mm x 2.0mm)
- Required glass thickness
A Deeper Look: DVS-EM100 Series
Detailed technical manuals, electrical schematics (bridge circuit diagrams), and 3D step-files are available upon request to support your integration process.
Do not hesitate to contact our engineering team for the full documentation package:
engineering@davisol.ch
DAVISOL, Engineering that Delivers.