DVS-EM600
High-Precision Pressure Sensor Die
The DVS-EM600 is a high-stability, high-temperature piezoresistive silicon sensing element. Optimized for industrial-grade performance, it offers superior linearity and an expanded thermal operating range for mission-critical OEM integrations.
DAVISOL can customize the DVS-EM600 to match your specific sensing and integration requirements.
Integration Capabilities
- High-temperature industrial transmitters
- Aerospace and defense avionics
- Oil & gas downhole monitoring
- Specialized automotive engine sensors
Integration & Design-In
The DVS-EM600 is engineered for high-performance applications where standard dies fail to meet thermal or stability requirements.
Technical Suitability
- Optimized for gold wire or aluminum wire bonding
- Compatible with both oil-filled and dry-cavity packaging designs
Technical Specifications
Key performance parameters: DVS-EM600 High-Precision Pressure Sensor Die.
Performance Characteristics
Electrical Characteristics
Bridge resistance
4.4kΩ - 6.6kΩ
Power supply
Constant current/ voltage
Operating Voltage
5-10 V
Operating Current
Max 2 mA (1 mA typ)
Connection Type
Gold Wire Bonding Pads
Zero Offset
±20 mV
Temperature Coefficient of Resistance
1000 to 1500 ppm/°C (typ 1200)
Temperature Coefficient of Sensitivity
-1000 to 1000 ppm/°C
Pressure Range
0.5 - 35 PSI
Overload Pressure
300 %FS
Burst Pressure
400 %FS
Operating temperature
-40 to 125 °C
Ambient temperature
-55 to 150 °C
Pressure Hysteresis
max 0.1%FS
Non-Linearity
±0.25%FS
Pressure Repeatability
0.1%FS
±0.05%FS/ year
Long-Term Stability
Ordering Information
The DVS-EM600 is a high-specification component. To facilitate a successful design-in, please include the following parameters in your technical inquiry:
- Operating pressure range (e.g. 0.5 - 35 PSI)
- Outwards Dimensioning (e.g. 2.75mm x 2.75mm)
- Bonding SI Thickness 0.5-1 mm (configurable)
A Deeper Look: DVS-EM600 Die Series
DAVISOL, Engineering that Delivers.
Detailed technical manuals, electrical schematics (bridge circuit diagrams), and 3D step-files are available upon request to support your integration process.
Do not hesitate to contact our engineering team for the full documentation package:
engineering@davisol.ch