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ZXP600 High-Precision Pressure Sensor Die

The ZXP600 is a high-stability, high-temperature piezoresistive silicon sensing element. Optimized for industrial-grade performance, it offers superior linearity and an expanded thermal operating range for mission-critical OEM integrations.

As a specialized sensing element, DAVISOL provides the ZXP600 with customized metallization, specific die sizes, and tailored pressure ranges to ensure compatibility with your unique packaging and bonding processes.

Industrial Conveyor System
Integration Capabilities
  • High-temperature industrial transmitters
  • Aerospace and defense avionics
  • Oil & gas downhole monitoring
  • Specialized automotive engine sensors

Integration & Design-In

The ZXP600 is engineered for high-performance applications where standard dies fail to meet thermal or stability requirements.

Technical Suitability
  • Optimized for gold wire or aluminum wire bonding
  • Compatible with both oil-filled and dry-cavity packaging designs

Technical Specifications

Key performance and electrical parameters for the ZXP600 High-Precision Pressure Sensor Die.

Performance Characteristics
Electrical Characteristics

Pressure Range

0.5 - 35 PSI

Bridge resistance

4.4kΩ - 6.6kΩ

Power supply

Constant current/ voltage

Operating Voltage

5-10 V

Operating Current

Max 2 mA (1 mA typ)

Connection Type

Gold Wire Bonding Pads

Zero Offset

±20 mV

Temperature Coefficient of Resistance

1000 to 1500 ppm/°C (typ 1200)

Temperature Coefficient of Sensitivity

-1000 to 1000 ppm/°C 

Overload Pressure

300 %FS

Burst Pressure

400 %FS

Operating temperature

-40 to 125 °C

Ambient temperature

-55 to 150 °C 

Pressure Hysteresis

max 0.1%FS

Non-Linearity

±0.25%FS

Pressure Repeatability

0.1%FS

±0.05%FS/ year

Long-Term Stability

Ordering Information

The ZXP600 is a high-specification component. To facilitate a successful design-in, please include the following parameters in your technical inquiry:

  • Operating pressure range (e.g. 0.5 - 35 PSI)
  • Outwards Dimensioning (e.g. 2.75mm x 2.75mm)
  • Bonding SI Thickness 0.5-1 mm (configurable)
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Premium Precision, Optimized for Your Budget.

ZXP600 High-Precision Pressure Sensor Die: Technical Drawing & Dimensions

Detailed technical manuals, electrical schematics (bridge circuit diagrams), and 3D step-files are available upon request to support your integration process.

 

Do not hesitate to contact our engineering team for the full documentation package:

 

engineering@davisol.ch

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